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12.9mm-Thick-Wangling-F4BTMS1000-PCB: 4-Layer-Aerospace-Material-with-Enhanced Dielectric-Properties-and-Superior-Thermal-Conductivity |
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1. F4BTMS Introduction
The F4BTMS series represents a significant upgrade over the F4BTM series, delivering groundbreaking advancements in material formulation and manufacturing processes. This innovative material is enriched with a high concentration of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, resulting in remarkable improvements in performance and a wider range of dielectric constants. Designed for high-reliability applications, particularly in aerospace, the F4BTMS series is a dependable alternative to similar foreign products.
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The material’s unique composition combines a minimal amount of ultra-thin glass fiber cloth with a high proportion of uniformly distributed special nano-ceramics, blended with polytetrafluoroethylene resin. This formulation effectively mitigates the negative impact of glass fiber on electromagnetic wave propagation, significantly reducing dielectric loss while enhancing dimensional stability and minimizing X/Y/Z anisotropy. These improvements extend the usable frequency range, boost electrical strength, and increase thermal conductivity. Furthermore, the material boasts an excellent low thermal expansion coefficient and stable dielectric temperature characteristics, ensuring consistent performance under varying conditions. |
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As a standard feature, the F4BTMS series includes RTF low roughness copper foil, which reduces conductor loss and delivers exceptional peel strength. Compatible with both copper and aluminum bases, this series offers unparalleled versatility and reliability for demanding applications. Whether for aerospace or other high-performance industries, the F4BTMS series sets a new standard for advanced material technology. |
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2. Features of F4BTMS1000:
- Dielectric constant (Dk) of 10.2 at 10GHz
- Dissipation factor of .0020 at 10GHz, 0.0023 at 20GHz
- CTE x-axis of 16 ppm/°C, CTE y-axis of 18 ppm/°C, CTE z-axis of 32 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-320 ppm/°C, -55°C to 150°C
- High Thermal conductivity of 0.81 W/mk
- Low Moisture absorption of 0.03%
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3. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
F4BTMS1000 Core - 6.35 mm (250mil)
Copper_layer_2 - 35 μm
---------------------------- Prepreg RO4450F 0.102mm (4mil)
Copper_layer_3 - 35 μm
F4BTMS1000 Core - 6.35 mm (250mil)
Copper_layer_4 - 35 μm |
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| 4. PCB Construction Details: |
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| - Board dimensions: 145mm x 145 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/7 mils
- Minimum Hole Size: 1.2mm
- No Blind vias.
- Finished board thickness: 12.9mm
- Finished Cu weight inner layer/outer layer: 1oz (1.4 mils)
- Via plating thickness: 20 μm
- Surface finish: HASL
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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5. PCB Statistics:
Components: 19
Total Pads: 77
Thru Hole Pads: 35
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 32
Nets: 2
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6. Type of artwork supplied: Gerber RS-274-X |
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7. Quality standard: IPC-Class-2 |
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8. Availability: worldwide |
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9. Some Typical Applications:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and others. |
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NEXT: 1.6mm-Isola-FR408HR-TG190-4-Layer-PCB-with-Via-in-Pad-and-ENIG: Superior-Performance-and-AOI-Compatibility |
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